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Events

SEMICON West 2016

As the industry leader in automation software, we participate at several global events annually. Find out where we’ll be.

2018 upcoming events


CPES2018 (Intelliflex) - Presenter

Doug SuerichDoug Suerich, Product Evangelist
"Moving towards High-Volume Manufacturing with standards"

Location: Centennial College, Toronto, ON
Date: May 24, 2018
Time: 10:00-10:15am

Doug will discuss moving toward high-volume FHE manufacturing with standards, by drawing on the lessons learned from the semiconductor industry to bridge the gap between prototyping and high-volume production.



SEMICON West - Booth 1817, South Hall

July 10-12, 2018

SEMICON West logo

Moscone Center
San Francisco, USA

Contact information: sales@peergroup.com

Doug Suerich

SEMICON West - Presenter

Doug Suerich, Product Evangelist
"Architecting for agility: incorporating IIOT into your data collection"

Location: Smart Manufacturing Pavilion, Moscone South
Date/time: TBD

Abstract:
Equipment manufacturers are under pressure to reduce costs while maintaining or increasing quality and contributing to overall customer throughput. Increasingly, innovative end users are looking for big data solutions that will help them introduce extra efficiencies in their factories. While modern machine learning and artificial intelligence algorithms hold the promise of near-magical problem solving and fault detection capabilities, they have one major weakness: a voracious appetite for high volumes of data. These trends are increasing the demands on tool makers to provide even faster data collection and sensor data for variables that were not included in their original tool specifications. Meeting these demands from end customers requires the OEM to adopt an agile approach, where additional sensors and data collection plans can be deployed rapidly and customized on existing equipment platforms. The Industrial Internet of Things (IIoT) promises a solution to the hardware side of the problem (through the availability of cost-effective sensors, etc.) and capturing the data at the source, but this leaves unanswered questions around the best ways to share that data. The industry needs to consider equipment performance, security, stability, and long-term maintainability of the solution. Smart manufacturing and data collection expert, Doug Suerich, discusses practical ways to meet these challenges without massive investment or diversion from existing SEMI Standards.




SEMICON Taiwan - Booth K2666, 1F

September 5-7, 2018

SEMICON Taiwan logo

Taipei Nangang Exhibition Center
Taipei, Taiwan

Contact information: sales@peergroup.com




SEMICON Europa, co-located with electronica - Booth A4445, A4

November 13-16, 2018

SEMICON Europa logo

Messe München
Munich, Germany

Contact information: sales@peergroup.com




SEMICON Japan - Booth TBD

December 12-14, 2018

Tokyo Big Sight
Tokyo, Japan

Contact information: sales@peergroup.com


2018 past events


SEMICON Korea - Booth 319, Hall D

January 31 - February 2, 2018

SEMICON Korea logoCOEX
Seoul, Korea

Contact information: sales@peergroup.com



ACM Education - Presenter

Michael ArnoldMichael Arnold, Managing Director, PEER Group GmbH
“Automation Capability Management: Lessons Learned in the Semiconductor Industry”

Location: FH Kärnten, Lakeside Park, Klagenfurt, Austria
Date: Thursday, February 8, 2018
Time: 17:00




2018FLEX - Presenter and Session Sponsor

Doug SuerichDoug Suerich, Product Evangelist
"Moving towards high-volume manufacturing with standards"

Flexible & Printed Electronics Conference & Exhibition
Location: Hyatt Regency Monterey Hotel & Spa, Monterey, California
Date: Thursday, February 15, 2018
Time: 9:25-9:45am
Agenda: http://www.semi.org/en/2018flex-agenda
Sponsor: PEER Group is the proud sponsor of the “Standards and Reliability” session on February 15

Abstract:
Revolutionary advances in flexible electronics hold the promise of producing innovative new products at lower cost than traditional methods. However, the gap between prototype production and high-volume manufacturing (HVM) can be daunting. How can you ensure that you have the infrastructure in place to move your process from the laboratory to the complexities and uncertainties of real-world manufacturing, especially in a smart factory? Fortunately, lessons learned in the semiconductor manufacturing industry provide clear guidance for making the move towards full automation and standardized data collection and material handling.

This presentation reviews the fundamental requirements for making the transition from pilot process to implementation inside a modern production facility and value chain. We’ll discuss design patterns and standards for automation, big data collection and security that you can implement now to help simplify future sales to demanding customers. We’ll also introduce a path for taking your HVM to the next level: introducing essential concepts for realizing smart manufacturing and Industry 4.0. Modern analytics can be used to monitor a fleet of deployed equipment to find opportunities for improvement (e.g., enabling predictive maintenance to reduce unplanned equipment downtime). However, this can only work if the collected data is consolidated securely into a central location. The basic data collection infrastructure we recommend paves the way for a complete, secure remote connectivity and data sharing solution that provides equipment makers and manufacturers a powerful new and secure way to collaborate.




Global Smart Manufacturing Summit - Presenter

Michael Arnold

Michael Arnold, Managing Director, PEER Group GmbH
“CASE STUDY: Industry 4.0 – The Evolution of the Revolution” 

Michael’s case study will highlight the characteristics and driving factors of the industrial revolutions. He will provide an assessment of where we are today, the leadership question, and factors for success. 

Location: Marriott Hotel, Stuttgart, Germany
Date: Wednesday, February 21, 2018
Time: 15:05
Details: https://annolucis.net/smart-manufacturing-summit-2018/




SEMICON China - Booth 2785, N2

March 14-16, 2018

SEMICON China logo

Shanghai New International Expo Centre
Shanghai, China

Contact information: sales@peergroup.com




APC|M Europe Conference - Presenter and Session Sponsor

Doug SuerichDoug Suerich, Product Evangelist
"Secure Data Collection Across an OEM's Fleet of Tools"

Location: Dresden, Germany
Date: April 16-18, 2018
Sponsor: PEER Group is a proud sponsor of the "Factory productivity and automation" session




Advanced Semiconductor Manufacturing Conference (ASMC) - Poster Presentation

April 30 - May 3, 2018

Doug Suerich

Doug Suerich, Product Evangelist
"A systematic approach to secure data collection across an OEM's fleet of tools"

Location: Saratoga Springs, NY
Date: Tuesday, May 1, 2018
Time: 5:15-6:45pm, Session 5

Abstract:
This paper discusses the approaches the PEER Group team took to design and implement a secure data management system to collect data from tools installed at fabs in different geographic locations and to move that data to a cloud-based storage system. The motivation for our work was to find the best way to match equipment performance across a global fleet of tools using modern analytics for predictive decision-making. However, gathering the data and feeding it into remote analytics software to perform fleet-wide comparisons presents familiar obstacles related to IP protection, the management of big data, and implementation risk. The majority of the effort in creating such a data collection system did not lie in the movement of the data, but rather in the systematic identification and assessment of objections to data sharing in a notoriously secretive industry. By explicitly addressing each of the concerns related to secure data sharing, PEER Group was able to create a system that allowed for limited collection of data in a means acceptable to all stakeholders.




Archived events


  • 150+
    OEM customers
  • 60,000+
    active equipment connections
  • 80+
    tool platforms automated
  • 100+
    fab acceptances