background image

Archived events

12/14/2016:SEMICON Japan - Presenter

SEMICON Japan - Presenter

Doug Suerich

Doug Suerich, Product Evangelist
“Leveraging SEMI standards to enable smart manufacturing in existing facilities”

TechSPOT WEST Exhibitor Presentations
Date: Wednesday, December 14
Time: 15:00

Abstract
The emerging IoT market is driving the growth of 200mm fabs which have traditionally not embraced the level of automation found in 300mm manufacturing facilities. However, as the demand for low-cost devices increases, better manufacturing control is becoming a must for all fabs. Emerging smart manufacturing technologies hold the promise of providing the flexibility required to respond rapidly and cost-effectively in both high-volume/low-mix and high-volume/high-mix production environments. However, adding such technologies can be challenging to implement in facilities with existing equipment and manufacturing operation systems that do not support easy customizations. This discussion proposes an architecture that leverages existing SEMI standards to retrofit a fab with the latest big data and analysis capabilities but without impacting existing equipment and operations.

12/14/2016:SEMICON Japan - Booth 3205, Hall 3

SEMICON Japan - Booth 3205, Hall 3

14-16 December 2016

At SEMICON Japan, we co-exhibit with our Japanese distributor, Mizuho Information & Research

SEMICON Japan Logo

Tokyo Big Sight
Tokyo, Japan

Contact information: bill.schmalz@peergroup.com

11/08/2016:electronica

electronica

8-11 November 2016

electronica logoMesse München
Munich, Germany

Contact information: maik.adler@peergroup.com

11/07/2016:North America SEMI Standards Fall 2016 Meetings

North America SEMI Standards Fall 2016 Meetings

7-10 November 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

Semi Logo

San Jose, CA
USA

Contact information: alison.mckenzie@peergroup.com

10/26/2016:SEMICON Europa - Presenter

SEMICON Europa - Presenter

26 October 2016

Doug SuerichDoug Suerich, Product Evangelist
“Turning Data into Action: The Importance of On-Tool Data Brokers for Enabling Big Data Analytics and Increasing Fab Productivity”

TechLOUNGE Session 2: Fab Productivity and Smart Manufacturing
Wednesday, October 26, 2016
12:00

Abstract 
In today’s connected world, smart manufacturing initiatives make it possible for semiconductor device makers to leverage data, gain insights into their processes, and make manufacturing decisions and processing modifications that will improve fab productivity. 

Data collection has always been an essential part of semiconductor manufacturing and now, successful big data solutions enable intelligent analysis and allow manufacturers and suppliers to turn their collected data into action. As the cost of adding more sensors and data sources to equipment continues to become more affordable, it’s important to consider how to broker high volumes of sensitive data at high speeds from disparate sources, how to consolidate the data on a single tool or across multiple tools to enable data analytics, and how to segregate IP and share information securely across business partners. 

Interconnecting equipment and process data provides new opportunities to fabs and OEMs to feed efficiency gains back into the manufacturing process. 

  • OEMs can analyze the data near-tool or even remotely and make equipment adjustments, ensure optimal equipment performance during production, and provide a higher standard of service to the fab through more efficient and cost-effective tool support. 
  • The fab will benefit from more efficient, autonomous manufacturing as it leverages equipment data to remove production inefficiencies, reduce costs, and improve uptime and yield. 

Join us in the TechLOUNGE as we explore the concept of data brokering through a secure pipe to enable a new generation of OEM and fab collaboration, central to smart manufacturing. 

10/25/2016:SEMICON Europa - Booth 362

SEMICON Europa - Booth 362

25-27 October 2016

SEMICON Europa logo

Alpexpo
Grenoble, France

Contact information: bill.schmalz@peergroup.com

10/25/2016:SEMICON Europa - Session Chair

SEMICON Europa - Session Chair

25 October 2016

Michael ArnoldMichael Arnold, Managing Director, PEER Group GmbH
Smart & Sustainable Manufacturing Session Chair
TechARENA 1
14:00-16:45

Session agenda: www.semiconeuropa.org/node/3396

Contact information: michael.arnold@peergroup.com

10/20/2016:APC Conference IMA-APC Council Meeting - Presenter

APC Conference IMA-APC Council Meeting - Presenter

20 October 2016

Doug SuerichDoug Suerich, Product Evangelist 

IMA-APC Council Meeting
Hilton Phoenix / Mesa Hotel, Arizona 
9am-12pm

Meeting topic: Security of Data and Intellectual Property in Fabs: Challenges and Potential Solutions
Meeting agenda: www.cvent.com/events/apc-conference-xxviii-2016

Contact information: doug.suerich@peergroup.com

10/17/2016:APC Conference XXVIII 2016

APC Conference XXVIII 2016

17-20 October 2016

Hilton Phoenix / Mesa Hotel
Mesa, Arizona
USA

09/15/2016:European MEMS Summit 2016

European MEMS Summit 2016

MEMS Summit

15-16 September 2016

Maritim Hotel Stuttgart
Stuttgart, Germany

Contact information: maik.adler@peergroup.com

09/07/2016:SEMICON Taiwan

SEMICON Taiwan

7-9 September 2016

SEMICON Taiwan logo

Taipei Nangang Exhibition Center
Taipei, Taiwan

Contact information: bill.schmalz@peergroup.com

07/12/2016:SEMI Standards Meetings

SEMI Standards Meetings

12-14 July 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

SEMI logo

Moscone Center
San Francisco, USA

Contact information: alison.mckenzie@peergroup.com

07/12/2016:SEMICON West - Booth 1239, South Hall

SEMICON West - Booth 1239, South Hall

12-14 July 2016

SEMICON West logo

Moscone Center
San Francisco, USA

Contact information: bill.schmalz@peergroup.com

05/16/2016:ASMC 2016

ASMC 2016

16-19 May 2016

ASMC Logo

Saratoga Springs, USA

Contact information: mike.barrett@peergroup.com

04/04/2016:North America SEMI Standards Spring 2016 Meetings

North America SEMI Standards Spring 2016 Meetings

4-7 April 2016

PEER Group actively participates in SEMI automation standards development including review and discussion with other industry participants.

SEMI logo

San Jose, CA
USA

Contact information: alison.mckenzie@peergroup.com

03/15/2016:SEMICON China

SEMICON China

15-17 March 2016

SEMICON China logo

Shanghai New International Expo Centre
Shanghai, China

Contact information: bill.schmalz@peergroup.com

01/27/2016:SEMICON Korea - Booth 5728, Hall D

SEMICON Korea - Booth 5728, Hall D

27-29 January 2016

At SEMICON Korea, we co-exhibit with our Korean distributor, ELIM Technology

SEMICON Korea logo

COEX
Seoul, Korea

Contact information: bill.schmalz@peergroup.com

12/16/2015: SEMICON Japan

SEMICON Japan - Booth 2304, Hall 2

16-18 December 2015 

SEMICON Japan 2015 logo

Location:
Tokyo Big Sight
Tokyo, Japan
Visit us and our Japanese distributor, Mizuho Information and Research Institute, in Booth 2304, Hall 2.

10/06/2015: SEMICON Europa

SEMICON Europa - Booth 1242

6-8 October 2015

SEMICON Europa 2015 logo Location:
Messe Dresden
Dresden, Germany
Visit us in Booth 1242

10/06/2015: SEMICON Europa - Industry 4.0 Session Chair Michael Arnold

SEMICON Europa - Industry 4.0 Session Chair Michael Arnold

Michael Arnold

Location:
TechARENA 2, MESSE Dresden
Dresden, Germany

Session and Time:
Industry 4.0 Session
Chair / Moderator: Dr. Michael Arnold, Managing Director, PEER Group GmbH
6 October 2015
13:30-17:00

09/02/2015: SEMICON Taiwan

SEMICON Taiwan

2-4 September 2015

SEMICON Taiwan 2015 logo Location:
TWTC Nangang Exhibition Hall
Taiwan
Contact Information: bill.schmalz@peergroup.com

07/14/2015: SEMICON West

SEMICON West - Booth 1922, South Hall

14-16 July 2015

SEMICON West 2015 logo Location:
Moscone Center San Francisco, USA

04/13/2015: APC|M Europe Conference - Presenters

APC|M Europe Conference - Presenters

13-15 April 2015

APC|M Europe logo

Location:
Freising, Germany

PEER Group Speaker and Topic:
Roland Willmann
Presentation: "Transition of high automation manufacturing to Semantic Web Technologies"
Tuesday, April 14th

Abstract:
The presentation provides an insight to Semantic Web Technologies and how they support requirements which are discussed in the context of the Industry 4.0. initiative. The focus is twofold: on opportunities where Semantic Web Technology can be applied during a standardization process, and on a development path towards the application of Semantic Web Technology in a high-automation factory.

03/17/2015: SEMICON China

SEMICON China

17-19 March 2015

SEMICON China 2015 logo Location:
Shanghai New International Expo Centre
Shanghai, China
Contact Information: bill.schmalz@peergroup.com

02/08/2015: Trade Mission to South Korea - Delegate

Trade Mission to South Korea - Delegate

8-11 February 2015

Location:
Seoul, South Korea

Bill Schmalz joins Canada's Minister of International Trade, The Honorable Ed Fast, and other Canadian delegates on this trade mission.

02/04/2015: SEMICON Korea

SEMICON Korea - Booth 5750, Hall D

4-6 February 2015

SEMICON Korea 2015 logo Location:
COEX
Seoul, Korea
February 4-6, 2015
Visit us in Hall D, Booth 5750

12/03/2014:SEMICON Japan

SEMICON Japan

3-5 December 2014

SEMICON Japan 2014 logoLocation:
Tokyo Big Sight
Tokyo, Japan
Visit PEER Group at Mizuho Information
and Research Institute Inc.'s booth at: Hall 2, Booth 2007

11/20/2014SME Support Japan New Value Creation Exhibition 2014 - Presenter

SME Support Japan New Value Creation Exhibition 2014 - Presenter

20 November 2014

Location:Michael Arnold
Tokyo Big Sight
Tokyo, Japan
 
PEER Group Speaker and Topic:
Dr. Michael Arnold - Managing Director, PEER Group GmbH
"Industry 4.0: An IT Solutions Company's Perspective"

Abstract:
The German initiative Industry 4.0 shall strengthen the country’s position as one of the leading industry regions and suppliers of factories by leveraging IT solutions for creating something revolutionary. The implementation, however, will take into account the business reality of existing and new factories and their equipment suppliers. Several elements of this process are discussed from the perspective and the experience of an IT solutions provider.

10/07/2014:SEMICON Europa - Presenter

SEMICON Europa - Presenter

7-9 October 201
SEMICON Europa 2014 logo

Location:
Alpexpo
Grenoble, France
Visit us in Booth 261

 
PEER Group Speaker and Topic:William Schmalz
William Schmalz - Director, Global OEM Sales
"An Agile Approach to Automation Software for Tool Control"

Location:
TechARENA 1
October 7, 2014
Time: 16:10

Abstract:
As fabs strive for more productive manufacturing processes, OEMs are forced to become more agile in the deployment of their tools. In the old paradigm of tool automation and control development, this requirement for agility causes tension between cost-effective tool development and long-term maintainability. We are presenting our suite of off-the-shelf tool automation development products architected specifically for the semiconductor tool maker to enable agility and cost-effective maintainability. Using our products, OEMs can meet the fab’s needs for productive manufacturing, while reducing turnaround times, time to market, and cost of ownership. Learn how PEER Group’s product team has designed our OEM product suite to help tool builders become more agile and cost effective at developing and supporting next-generation tool development.

09/03/2014:SEMICON Taiwan

SEMICON Taiwan

3-5 September 2014
SEMICON Taiwan 2014 logo

Location:
TWTC Nangang Exhibition Hall
Taiwan
Contact Information: bill.schmalz@peergroup.com

07/08/2014:SEMICON West

SEMICON West

8-10 July 201
SEMICON West 2014 logo

Location:
Moscone Center
San Francisco, USA
Visit us in South Hall, Booth 1622

04/07/2014:APC|M Europe Conference - Presenter

APC|M Europe Conference - Presenter

7-9 April 2014

APC|M Europe logoLocation:
Rome, Italy

PEER Group Speaker and Topic:
Roland Willmann
"Fast Machine Ramp-up Through a Comprehensive Equipment Automation Platform"

Roland will talk about an innovative multilayer software architecture for equipment automation purposes. This architecture enables flexible and reusable abstraction of production equipment in order to improve collected data quality, ensure fast integration of new clustered production machines into the factories IT-landscape and therefore to save significant time during capacity ramp-up of your production. Typical cases are discussed as well.

03/18/2014:SEMICON China

SEMICON China

18-20 March 2014
SEMICON China 2014 logo

Location:
Shanghai New International Expo Centre
Shanghai, China

02/12/2014:SEMICON Korea

SEMICON Korea

12-14 February 201
SEMICON Korea 2014 logo

Location:
COEX
Seoul, Korea
Visit us in Hall B, Booth 4205

12/04/2013:SEMICON Japan

SEMICON Japan

4-6 December 2013

SEMICON Japan 2013 logoLocation:
Makuhari Messe
Chiba, Japan
Visit PEER Group at Mizuho Information
and Research Institute Inc.'s booth at: Hall 5, Booth 5B-404

10/08/2013:SEMICON Europa

SEMICON Europa

8-10 October 2013

SEMICON Europa 2013 logoLocation:
Messe Dresden
Dresden, Germany
Hall 1, Booth 1660

07/09/2013: SEMICON West

SEMICON West

9-11 July 2013

SEMICON West 2013 logoLocation:
Moscone Center
San Francisco, CA
South Hall, Booth 1647

03/19/2013:SEMICON China

SEMICON China

19-21 March 2013

SEMICON China 2013 logoLocation:
Shanghai New International Expo Centre
Shanghai, China
View our joint automation and control solution
with MKS Instruments in Booth 3461

01/31/2013:SEMICON Korea

SEMICON Korea

31 January - 1 February 2013

SEMICON Korea 2013 logoLocation:
COEX
Seoul, Korea

12/05/2012: SEMICON Japan

SEMICON Japan

5-7 December 2012

Location:
Makuhari Messe
Japan
Hall 5, Booth 5B-404

10/09/2012:SEMICON Europa

SEMICON Europa

9-11 October 2012

Location:
Messe Dresden
Dresden, Germany
Hall 1, Booth 1.222

09/27/2012:PEER Group and Owens Design seminar: Building Software Flexibility and Reliability into Automated Systems

PEER Group and Owens Design seminar: Building Software Flexibility and Reliability into Automated Systems

27 September 2012

Owens Design logoLocation:
47427 Fremont Blvd.
Fremont, California

07/10/2012:SEMICON West

SEMICON West

10-12 July 2012

Location:
Moscone Center
San Francisco, CA
South Hall, Booth 1643

12/07/2011:SEMICON Japan

SEMICON Japan

7-9 December 2011

Location:
Makuhari Messe,
Chiba, Japan

10/11/2011: SEMICON Europa

SEMICON Europa

11-13 October 2011

Location:
Messe Dresden,
Germany
Hall 1, Booth 1.035

09/15/2011:Process Optimization Workshop

Workshop Process Optimization, Continuous Improvement and Intelligent Process Control in the Daily Manufacturing Practice

25 September 2011

A joint workshop presented by GE Intelligent Platforms Europe S.A. and PEER Group GmbH.

Location:
Dresden, Germany

Today’s typical manufacturing processes are characterized by a high complexity governed by multidimensional cause-effect networks, the exploration of which can be a challenging endeavor. Nevertheless, root causes for process excursions and disturbances of the manufacturing process have to be identified and corrected for within the shortest timeframe possible. To do this successfully will require monitoring and control mechanisms of considerably higher performance and intelligence.

 With Proficy Troubleshooter and Proficy Cause+ our workshop introduces solutions of GE IP (General Electric / Intelligent Platforms), which enable process and manufacturing experts, automation and control engineers as well as maintenance specialists and teams to achieve faster process analysis, improved monitoring and optimized process control within a unified open framework. Besides talks which highlight several aspects of the functionality of Proficy Troubleshooter and Proficy Cause+, we will demonstrate the capabilities for analysis, optimization and improved process control using the example of a concurrent flow drying process.





Workshop Prozessoptimierung, kontinuierliche Verbesserung und intelligente Prozessführung in der betrieblichen Praxis

Donnerstag, 15. September 2011 in Dresden

Heutige Fertigungsprozesse sind geprägt durch eine typischerweise hohe Komplexität mit nicht einfach verstehbaren, vieldimensionalen Ursache-Wirkungs-Gefügen. Dennoch sind Ursachen für Abweichungen vom Sollverhalten und von Störungen des Prozesses in kürzester Zeit zu ermitteln und nachhaltig zu beseitigen. Dies gelingt nur durch eine wesentlich höhere Leistungsfähigkeit und Intelligenz der eingesetzten Regelungs- und Überwachungsverfahren. 

Unser Workshop stellt mit den Produkten Proficy Troubleshooter und Proficy Cause+ Lösungen von GE-IP (General Electric / Intelligent Platforms) vor, die es unter anderem Prozess- und Anlagenspezialisten, Automatisierungsfachleuten und Wartungs- und Instandhaltungsteams ermöglichen, die Zielstellungen einer schnelleren Problemanalyse, verbesserten Überwachung und optimierten Prozessregelung in einem einheitlichen und offenen Framework zu erreichen. Neben Vorträgen, die die Funktionalität von Proficy Troubleshooter und Proficy Cause+ beleuchten, demonstrieren wir Ihnen die Möglichkeiten zur Analyse, Optimierung und verbesserten Regelung Ihrer Prozesse und Verfahren am praktischen Beispiel eines Gleichstrom-Trockenprozesses.

07/12/2011: SEMICON West

SEMICON West

12-14 July 2011

Location:
San Francisco, CA
July 12-14, 2011
South Hall, Booth 419

AEC/APC North America 2010

AEC/APC Symposium Presentation

Title: The Importance of EEQA Common Component Template Definitions
Author(s): Mike Thiessen, Gino Crispieri
Affiliation: PEER Group, International SEMATECH Manufacturing Initiative (ISMI)
Presenter: Mike Thiessen
E-mail: mike.thiessen@peergroup.com

Abstract 

Enhanced Equipment Quality Assurance (EEQA) is the foundation of collaborative activities to lower cost and improve equipment availability in the semiconductor industry. Based on six important Equipment Engineering System (EES) guidelines that promote the definition, availability, and sharing of EES data, EEQA is the core activity that enables the OEM and IC maker to improve and increase equipment efficiency and reliability during its lifecycle.

EEQA requires the OEM to make functional equipment data available by specifying parametric data as defined by the EEQA Common Component Templates. These templates focus on the functions, events, and data parameters of the equipment’s main components that the supplier and/or IC maker identifies are critical when monitoring the overall equipment’s function and its components’ performance to ensure process reliability. EEQA Common Component Templates are also used by IC makers to confirm that the equipment functions as the OEM intended and to facilitate the visualization and analysis of the data. Once data is made available by the OEM, both the OEM and IC maker can use the data to visualize, determine, and understand the equipment’s behavior and monitor and improve its functional performance. EEQA data helps track and improve the equipment’s reliability and efficiency.

This presentation describes a collaborative effort between PEER Group and ISMI to identify common component data and events for equipment and highlights the importance of data that is not currently defined in any existing SEMI standard. Practical examples will focus on how this data can be managed on the tool and communicated to the IC maker. Additionally, the benefits of using this data for tool acceptance benchmarks will be analysed.

  • 150+
    OEM customers
  • 50,000+
    equipment connections in service
  • 70+
    tool platforms automated
  • 40+
    fab acceptances